Datacon’s 2200 evo will suit your laboratory.

The Future of Advanced Packaging Available Today. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands.Datacon EVO 2200 Automated multi-chip die bonder for positioning and attaching small electronic components on printed circuit board or substrate. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy.Ĭustomers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Further information on imec can be found at Stay up to date about what’s happening at imec with the monthly imec magazine, available for tablets and smartphones (as an app for iOS and Android), or via the website About Besiīesi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. In 2012, imec's revenue (P&L) totaled 320 million euro. Its staff of over 2,080 people includes more than 670 industrial residents and guest researchers. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society.

Imec delivers industry-relevant technology solutions. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec performs world-leading research in nanoelectronics. “This collaboration will enable us to benchmark our Chameo tool to meet the industrial needs of the semiconductor industry, offering our customers a viable and effective solution for 2.5D/3D IC manufacturing.” About imec “We are excited to work with a key research center such as imec and leverage its expertise in fine pitch bonding materials and processes to increase the yield and reliability of our equipment ,” said Richard Blickman, CEO at Besi. Imec and Besi will conduct joint research to develop a high-throughput thermocompression bonder in an automated process flow, with high accuracy and shorter cycle times, paving the way to enabling a manufacturable 3D, 2.5D and 2.5D/3D hybrid technology. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, although with this comes long cycle times due to temperature and pressure profiles and processing methods which hinder industrial adoption of this technology up to now. This needs high accuracy in bonding within the range of 1-2um Moreover, an automatic process flow is essential for industrial adoption.

Datacon 2200 evo plus